Dev kit uses backscatter Wi-Fi for low-power connectivity

HaiLa Technologies has introduced the EVAL2000 development board, featuring its BSC2000 passive backscatter Wi-Fi chip and ST’s STM32U0 MCU. The platform empowers developers and researchers to create ultra-low-power connected sensor applications over Wi-Fi.

The BSC2000 is a monolithic chip that combines analog front-end and digital baseband components to implement HaiLa’s backscatter protocol for 802.11 1-Mbps Direct Sequence Spread Spectrum (DSSS) over Wi-Fi. By using backscattering, it enables low-power communication by reflecting existing Wi-Fi signals instead of generating its own. This allows devices to transmit data with minimal energy consumption. Leveraging readily available, standard Wi-Fi infrastructure, the BSC2000 backscatter Wi-Fi chip collects and transmits sensor data with power efficiency that extends the life of battery-operated sensors.

The EVAL2000 development board accelerates prototyping with GPIO, I²C, and SPI sensor interfaces. Sensor integration is handled through firmware on the MCU. The kit also includes an onboard temperature/humidity sensor.

The BSC2000 EVAL2000 development kit is available for preorder, with shipping anticipated for Q1 2025. For more information on the backscatter Wi-Fi chip and development kit, click here.

HaiLa Technology 

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