The 200G/lane CPO pushes optical interconnect boundaries

A new co-packaged optics (CPO) solution claims to set the bar for next-generation interconnects serving hyperscale data centers and artificial intelligence (AI) workloads. Broadcom’s third-generation CPO technology delivers 200G per lane while significantly improving thermal designs, handling procedures, fiber routing, and overall yield.

Broadcom’s 200G co-packaged optics is engineered to address scale issues in interconnect, which often lead to link flaps and operational disruptions. This, in turn, affects the industry’s ability to achieve the lowest cost per token. The 200G CPO technology enables scale-up domains to exceed 512 nodes while addressing the bandwidth, power, and latency challenges associated with the increasing size of next-generation foundation model parameters.

CPO is a heterogeneous integration of optics and silicon on a single packaged substrate. Source: Broadcom

A CPO system design integrates optical and electrical components to maximize performance with lower-power optical interconnects. According to Near Margalit, VP and GM of the Optical Systems Division at Broadcom, the company’s CPO technology is driven by its switch ASICs, optical engine, and an ecosystem of passive optical components, interconnects, and system solutions partners.

Broadcom is working closely with its ecosystem partners to optimize the integration of CPO solutions. For instance, it has teamed up with Corning on advanced fiber and connector technologies. It’s also working closely with Twinstar Technologies on high-density fiber cables to scale optical interconnects in next-generation data center and AI infrastructures.

Broadcom’s CPO legacy

Broadcom began its CPO journey in 2021 with the launch of the first-generation Tomahawk 4-Humboldt chipset, which included high-density integrated optical engines, edge coupling, and detachable fiber connectors. Next, the second-generation Tomahawk 5-Bailly chipset deployed 100G per lane. According to Broadcom, it was the industry’s first volume-production CPO solution.

Now, after the launch of the third-generation 200G/lane CPO, Broadcom has telegraphed its commitment to developing a fourth-generation 400G/lane solution. That marks a steady progression of optical interconnect solutions for AI workloads driving higher bandwidth, lower latency, and more power-efficient optical interconnects.

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